[IEEE 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Singapore, Singapore (2019.3.12-2019.3.15)] 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Electroplating of Through Silicon Vias: A Kinetic Monte Carlo Model
MingRui, Lai, Hariharaputran, Ramanarayan, Khoo, Khoong Hong, Hongmei, Jin, Wu, Shunnian, Joshi, Chaitanya Amol, Mangipudi, Kodanda Ram, Quek, Siu Sin, Wu, David T., Narayanaswamy, Sridhar, SrinivasanYear:
2019
Language:
english
DOI:
10.1109/EDTM.2019.8731250
File:
PDF, 189 KB
english, 2019