[IEEE 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Clear Water Bay, Hong Kong (2018.12.17-2018.12.20)] 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers.
Gschwandl, Mario, Frewein, Markus, Fuchs, Peter Filipp, Antretter, Thomas, Pinter, Gerald, Novak, PhilippYear:
2018
DOI:
10.1109/EMAP.2018.8660763
File:
PDF, 605 KB
2018