[IEEE 2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS) - Kita-Kyushu City, Fukuoka, Japan (2019.3.18-2019.3.21)] 2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS) - Wafer-Level Test Solution Development for a Quad-Channel Linear Driver Die in a 400G Silicon Photonics Transceiver Module
Wang, Ye, Ding, Hanyi, Blakely, Barry, Yan, AidongYear:
2019
Language:
english
DOI:
10.1109/ICMTS.2019.8730947
File:
PDF, 2.63 MB
english, 2019