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[IEEE 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2014.10.22-2014.10.24)] 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Cu plating on film substrate by UV surface reformation treatment technology
Onitake, Shigeo, Harada, SusumuYear:
2014
Language:
english
DOI:
10.1109/IMPACT.2014.7048367
File:
PDF, 316 KB
english, 2014