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[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Design Study to Prevent Mold Delamination for Overmolded Lead Frame Package
Kim, Yeonsung, Raleigh, Carl, Saiyed, ShafiYear:
2019
Language:
english
DOI:
10.1109/ITHERM.2019.8757448
File:
PDF, 1.86 MB
english, 2019