3D Packaging and Integration of High-Density Tantalum...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

3D Packaging and Integration of High-Density Tantalum Capacitors on Silicon

Spurney, Robert Grant, Sharma, Himani, Pulugurtha, Raj, Tummala, Rao, Lollis, Naomi, Weaver, Mitch, Romig, Matt, Gandhi, Saumya, Brumm, Holger
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2923698
File:
PDF, 772 KB
english, 2019
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