Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding...

IEEE Transactions on Electron Devices 2019 / 7 Vol. 66; Iss. 7

Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration

Lu, Cheng-Hsien, Jhu, Shu-Yan, Chen, Chiao-Pei, Tsai, Bin-Ling, Chen, Kuan-Neng
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Volume:
66
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2019.2915332
Date:
July, 2019
File:
PDF, 4.42 MB
english, 2019
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