[IEEE 2019 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2019.3.18-2019.3.19)] 2019 China Semiconductor Technology International Conference (CSTIC) - An effective method to reduce bump defect is investigated
Guangxin, Xiang, Yiqi, Gong, Xiang, Wei, Zhigang, Luo, Yu, Bao, Haifeng, Zhou, Jingxun, Fang, Pang, AlbertYear:
2019
Language:
english
DOI:
10.1109/cstic.2019.8755607
File:
PDF, 1.54 MB
english, 2019