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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Reconfigurable X-shaped THz Metamaterials employing Quantum Dots
Vazquez-Colon, Clarissa D., Zepeda-Galvez, Juan Adrian, Ayon, Arturo A.Year:
2019
Language:
english
DOI:
10.1109/dtip.2019.8752863
File:
PDF, 312 KB
english, 2019