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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Development of PID material for top thin layer and inner layer insulation
Yoshino, Toshizumi, Nagoshi, Toshimasa, Nomoto, Shuji, Nakamura, Akihiro, Komuro, Nobuhito, Sawamoto, Hayato, Daijima, Yuta, Suzuki, YoshikazuYear:
2018
DOI:
10.1109/eptc.2018.8654403
File:
PDF, 711 KB
2018