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[IEEE 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) - Glasgow, United Kingdom (2019.7.8-2019.7.10)] 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) - OCM-PUF: organic current mirror PUF with enhanced resilience to device degradation
Qin, Zhaoxing, Shintani, Michihiro, Kuribara, Kazunori, Ogasahara, Yasuhiro, Sato, TakashiYear:
2019
Language:
english
DOI:
10.1109/fleps.2019.8792305
File:
PDF, 3.95 MB
english, 2019