[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression
Tsuchiya, Hideaki, Suzumura, Naohito, Shibata, Ryuji, Aono, Hideki, Ogasawara, Makoto, Akiba, Toshihiko, Sakata, Kenji, Nakagawa, Kazuyuki, Funaya, TakuoYear:
2019
Language:
english
DOI:
10.1109/irps.2019.8720501
File:
PDF, 788 KB
english, 2019