![](/img/cover-not-exists.png)
[IEEE 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Toulouse, France (2019.4.24-2019.4.26)] 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Bus Snubber Optimization for Multi-Chip Power Modules using SPICE Simulations
DeBoi, Brian T., Lemmon, Andrew N.Year:
2019
Language:
english
DOI:
10.1109/iwipp.2019.8799089
File:
PDF, 1.29 MB
english, 2019