[IEEE 2019 IEEE International Workshop on Integrated Power...

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[IEEE 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Toulouse, France (2019.4.24-2019.4.26)] 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Bus Snubber Optimization for Multi-Chip Power Modules using SPICE Simulations

DeBoi, Brian T., Lemmon, Andrew N.
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Year:
2019
Language:
english
DOI:
10.1109/iwipp.2019.8799089
File:
PDF, 1.29 MB
english, 2019
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