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Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability
Seo, Wonil, Ko, Yong-Ho, Kim, Young-Ho, Yoo, SehoonLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-01935-4
Date:
August, 2019
File:
PDF, 1.36 MB
english, 2019