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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Package Integrity and Reliability Effects of Mold Compound Chemistry for Power Device Application
Garete, April Joy H., Fernandez, Matthew M., Roscain, Reinald John S.Year:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654298
File:
PDF, 182 KB
english, 2018