[IEEE 2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS) - Kita-Kyushu City, Fukuoka, Japan (2019.3.18-2019.3.21)] 2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS) - Characterization of Micro-Bumps for 3DIC Wafer Acceptance Tests

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