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[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Optimal Filler Sizes for Thermal Interface Materials
Chowdhury, Piyas, Sikka, Kamal, Grill, Alfred, Parekh, Dishit P.Year:
2019
Language:
english
DOI:
10.1109/ITHERM.2019.8757459
File:
PDF, 1.19 MB
english, 2019