![](/img/cover-not-exists.png)
[IEEE 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Austin, TX (2018.9.24-2018.9.26)] 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Modeling the Influence of Grains and Material Interfaces on Electromigration
Filipovic, Lado, de Orio, Roberto LacerdaYear:
2018
Language:
english
DOI:
10.1109/SISPAD.2018.8551746
File:
PDF, 323 KB
english, 2018