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[IEEE 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) - Chambéry, France (2019.6.18-2019.6.21)] 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) - Thermal and Signal Integrity Analysis of Novel 3D Crossbar Resistive Random Access Memories
Zayer, F., Lahbacha, K., Dghais, W., Belgacem, H., Magistris, Massimiliano de, Maffucci, Antonio, Melnikov, Alexander V.Year:
2019
Language:
english
DOI:
10.1109/SaPIW.2019.8781680
File:
PDF, 2.24 MB
english, 2019