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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Combined Thick Resist Processing and Topography Patterning for Advanced Metal Plating
Eibelhuber, M., Rimbock, J., Zenger, T., Uhrmann, T., Matthias, T.Year:
2018
Language:
english
DOI:
10.1109/eptc.2018.8654312
File:
PDF, 689 KB
english, 2018