![](/img/cover-not-exists.png)
[IEEE 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA, USA (2018.10.15-2018.10.18)] 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - TSV Induced Stress Model and Its Application in Delay Estimation
Chawla, Raghav, Yadav, Sarita, Sharma, Arvind, Kaur, Baljit, Pratap, Rajendra, Anand, BulusuYear:
2018
Language:
english
DOI:
10.1109/s3s.2018.8640207
File:
PDF, 119 KB
english, 2018