Hot embossing of microstructure with moving induction heating and gas-assisted pressuring
Kao, Ching-Chieh, Ke, Kun-Cheng, Hung, Wei-Cheng, Yang, Sen-YeuLanguage:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-019-04560-7
Date:
August, 2019
File:
PDF, 2.28 MB
english, 2019