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Metals and Materials International 2019 / 6

Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process

Hua, Fu-an, Song, Hong-wu, Sun, Tao, Li, Jian-ping
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Language:
english
Journal:
Metals and Materials International
DOI:
10.1007/s12540-019-00333-z
Date:
June, 2019
File:
PDF, 1.39 MB
english, 2019
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