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[IEEE 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Clear Water Bay, Hong Kong (2018.12.17-2018.12.20)] 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Evaluation of Microscopic Strain Distribution of Low-Temperature Sintering Die Attach in Thermal Cycling Test
Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko, Matsuda, TetsuyaYear:
2018
Language:
english
DOI:
10.1109/EMAP.2018.8660822
File:
PDF, 300 KB
english, 2018