Noncontact Thickness Measurement of Cu Film on Silicon...

IEEE Access 2019 Vol. 7

Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application

Qu, Zilian, Wang, Wensong, Yang, Shuhui, Sun, Quqin, Fang, Zhongyuan, Zheng, Yuanjin
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Volume:
7
Year:
2019
Language:
english
Journal:
IEEE Access
DOI:
10.1109/access.2019.2921005
File:
PDF, 1.54 MB
english, 2019
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