Atomic layer deposition of WNx thin films using a F-free...

Thin Solid Films 2019 / 09 Vol. 685

Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier

Kim, Jun Beom, Nandi, Dip K., Kim, Tae Hyun, Jang, Yujin, Bae, Jong-Seong, Hong, Tae Eun, Kim, Soo-Hyun
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Volume:
685
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2019.06.051
Date:
September, 2019
File:
PDF, 2.99 MB
2019
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