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[IEEE 2019 Symposium on VLSI Technology - Kyoto, Japan (2019.6.9-2019.6.14)] 2019 Symposium on VLSI Technology - Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
Nogami, Takeshi, Huang, H., Shobha, H., Patlolla, R., Kelly, J., Penny, C., Hu, C.-K., Sil, D., DeVries, S., Lee, J., Nguyen, S., Jiang, L., Demarest, J., Li, J., Lian, G., Ali, M., Bhosale, P., LanziYear:
2019
DOI:
10.23919/VLSIT.2019.8776573
File:
PDF, 1.75 MB
2019