Automated X-ray recognition of solder bump defects based on ensemble-ELM
Su, Lei, Wang, LingYu, Li, Ke, Wu, JingJing, Liao, GuangLan, Shi, TieLin, Lin, TingYuJournal:
Science China Technological Sciences
DOI:
10.1007/s11431-018-9324-3
Date:
April, 2019
File:
PDF, 4.76 MB
2019