Transient thermal stress analysis of a thermoelectric cooler under pulsed thermal loading
Gong, Tingrui, Gao, Lei, Wu, Yongjia, Tan, Haoshu, Qin, Feng, Ming, Tingzhen, Li, JuntaoVolume:
162
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2019.114240
Date:
November, 2019
File:
PDF, 2.90 MB
2019