Copper(II) oxide powder manufacture for via-filling plating...

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Journal of Industrial & Engineering Chemistry 2019 / 7

Copper(II) oxide powder manufacture for via-filling plating from H2O2 type etching wastes

Lee, Seung Bum, Jung, Rae Yoon, Kim, Sunhoe
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Journal:
Journal of Industrial and Engineering Chemistry
DOI:
10.1016/j.jiec.2019.07.016
Date:
July, 2019
File:
PDF, 2.66 MB
2019
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