Intermediate layer-based bonding techniques for...

Intermediate layer-based bonding techniques for polydimethylsiloxane/digital light processing 3D-printed microfluidic devices

Cheon, Jeonghyeon, Kim, Seunghyun
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Volume:
29
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/ab27d3
Date:
September, 2019
File:
PDF, 1.39 MB
2019
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