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[IEEE 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2014.10.22-2014.10.24)] 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Development of a leakage-free disposable package for biosensors immersed in the chemical solutions
Chung, Kuan-Jung, Wu, Chia-CheYear:
2014
Language:
english
DOI:
10.1109/IMPACT.2014.7048439
File:
PDF, 278 KB
english, 2014