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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Stress and strain Analysis of LTCC substrate Module based on Microchannel
Wei, He, Huang, Chun-yue, Lu, Liang-kun, Wang, Jian-peiYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480463
File:
PDF, 4.88 MB
english, 2018