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Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature
Mohd Zubir, Noor Suhana, Zhang, Hongqiang, Zou, Guisheng, Bai, Hailin, Deng, Zhongyang, Feng, Bin, Wu, Aiping, Liu, Lei, Zhou, Y. NormanLanguage:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07532-9
Date:
August, 2019
File:
PDF, 4.45 MB
english, 2019