Reliability analysis of tape based chip-scale packages...

Microelectronics Reliability 2019 / 11 Vol. 102

Reliability analysis of tape based chip-scale packages based metamodel

Hamdani, Hamid, El Hami, Abdelkhalak, Radi, Bouchaïb
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Volume:
102
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.113445
Date:
November, 2019
File:
PDF, 2.58 MB
english, 2019
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