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AIP Conference Proceedings [Author(s) ADVANCED MATERIALS WITH HIERARCHICAL STRUCTURE FOR NEW TECHNOLOGIES AND RELIABLE STRUCTURES 2016: Proceedings of the International Conference on Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2016 - Tomsk, Russia (19–23 September 2016)] - Surface layer structure and average contact temperature of copper-containing materials under dry sliding with high electric current density
Fadin, V. V., Aleutdinova, M. I., Rubtsov, V. Ye., Aleutdinov, K. A.Volume:
1783
Year:
2016
Language:
english
DOI:
10.1063/1.4966347
File:
PDF, 1.58 MB
english, 2016