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[IEEE 2019 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) - Yokohama, Japan (2019.4.17-2019.4.19)] 2019 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) - Inter-Frame Smart-Accumulation Technique for Long-Range and High-Pixel Resolution LiDAR
Tanabe, Ken, Kubota, Hiroshi, Sai, Akihide, Matsumoto, NobuYear:
2019
Language:
english
DOI:
10.1109/CoolChips.2019.8721340
File:
PDF, 855 KB
english, 2019