[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Investigations of Aluminum Nitride based piezoelectric MEMS
Stiebing, Martin, Tavakolibasti, Majid, Stoeckel, Chris, Hiller, Karla, Wunderle, BernhardYear:
2019
Language:
english
DOI:
10.1109/DTIP.2019.8752638
File:
PDF, 2.27 MB
english, 2019