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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
Fowler, Michelle, Massey, John P., Braun, Tanja, Voges, Steve, Gernhardt, Robert, Wohrmann, MarkusYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00063
File:
PDF, 1.77 MB
english, 2019