![](/img/cover-not-exists.png)
[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Guided Interconnect - The Next-Generation Flex Circuits for High-Performance System Design
Kong, Jackson, Cheah, Bok Eng, Yong, Khang Choong, Hall, Stephen, Gantner, Eric, Sreerama, ChaitanyaYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654337
File:
PDF, 2.72 MB
english, 2018