[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Understanding of within Chip variation of optical appearance of Aluminum Pads
Lee, Lim Wei, Stefenelli, Mario, Baldevia, Agala Joel, Evelyn, NapetschnigYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654354
File:
PDF, 515 KB
english, 2018