[IEEE 2018 7th Electronic System-Integration Technology...

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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

HUANG, Z.Q., Poelma, R.H., Vollebregt, S., Koelink, M.H., Boschman, E., Kropf, R., Gallouch, M., Zhang, G.Q.
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Year:
2018
Language:
english
DOI:
10.1109/ESTC.2018.8546482
File:
PDF, 205 KB
english, 2018
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