[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A Numerical Analysis of Conductive Heat Transfer in Cylindrical Thermal Energy Storage Composites
Hoe, Alison, Deckard, Michael E., Felts, Jonathan, Shamberger, Patrick J.Year:
2019
DOI:
10.1109/ITHERM.2019.8757272
File:
PDF, 1.07 MB
2019