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[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints
Su, Sinan, Jian, Minghong, Wei, Xin, Akkara, Francy John, Hamasha, Sa'd, Suhling, Jeff, Lall, PradeepYear:
2019
DOI:
10.1109/ITHERM.2019.8757419
File:
PDF, 1.13 MB
2019