Modeling and Analysis of Electro-thermal Impact of...

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IEEE Transactions on Device and Materials Reliability 2019

Modeling and Analysis of Electro-thermal Impact of Crosstalk Induced Gate Oxide Reliability in Pristine and Intercalation Doped MLGNR Interconnects

Das, Subhajit, Bhattacharya, Sandip, Das, Debaprasad, Rahaman, Hafizur
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2019.2933035
File:
PDF, 3.81 MB
english, 2019
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