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[IEEE 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Montreal, QC, Canada (2019.5.26-2019.5.26)] 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Teamscale: Tackle Technical Debt and Control the Quality of Your Software
Haas, Roman, Niedermayr, Rainer, Juergens, ElmarYear:
2019
Language:
english
DOI:
10.1109/TechDebt.2019.00016
File:
PDF, 146 KB
english, 2019