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[IEEE 2018 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD) - Tianjin (2018.4.15-2018.4.18)] 2018 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD) - A New Testing Device for Bending Strain Effect on Superconducting Wires
Mao, Zhehua, Liu, Fang, Jin, Huan, Qin, Jinggang, Dai, Chao, Liu, Huajun, Wu, Yu, Mao, Zhehua, Dai, ChaoYear:
2018
Language:
english
DOI:
10.1109/asemd.2018.8558923
File:
PDF, 117 KB
english, 2018