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[IEEE 2019 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2019.3.18-2019.3.19)] 2019 China Semiconductor Technology International Conference (CSTIC) - Cobalt Electrofill for Future Generations of Contacts and Interconnects
Spurlin, Tighe A., Rigsby, Matthew A., Brogan, Lee, Doubina, Natalia, Liu, Yihua, Opocensky, Edward, Zhou, Jian, Reid, JonathanYear:
2019
Language:
english
DOI:
10.1109/cstic.2019.8755663
File:
PDF, 1.66 MB
english, 2019