[IEEE 2019 Symposium on Design, Test, Integration &...

  • Main
  • [IEEE 2019 Symposium on Design, Test,...

[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - A Feasibility Study on Piezoelectric MEMS Lateral Bulk Acoustic Wave Resonators including Thermal Effect

Bengashier, Mounira, Grech, Ivan, Casha, Owen, Portelli, Barnaby, Farrugia, Russell, Gatt, Edward
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2019
Language:
english
DOI:
10.1109/dtip.2019.8752755
File:
PDF, 969 KB
english, 2019
Conversion to is in progress
Conversion to is failed