[IEEE 2019 Symposium on Design, Test, Integration &...

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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Thermal aspects of a micro thermal conductivity detector for micro gas chromatography

Ali, Hany A., Pirro, Michele, Poulichet, Patrick, Cesar, William, Marty, Frederic, Azzouz, Imadeddine, Gnambodoe-Capochichi, Martine, Nefzaoui, Elyes, Bourouina, Tarik
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Year:
2019
Language:
english
DOI:
10.1109/dtip.2019.8752795
File:
PDF, 3.47 MB
english, 2019
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